ETS'07 - Vendor Sessions only

- Complete Program
- May 20th, 2007 only
- May 21st, 2007 only
- May 22nd, 2007 only
- May 23rd, 2007 only
- Presentation Sessions only
- Vendor Sessions only
- Posters Sessions only
- Panels Sessions only
- Tutorials only

May 20th, 2007

10:30-11:00 Coffee 

12:30-13:30 Lunch 

15:00-15:30 Coffee 

May 21st, 2007

10:30-11:00 Coffee 

08:30-10:30 Vendor Session 2C: Advanced DFT Tools

Moderators
- Peter Muhmenthaler : Infineon Technologies, DE
- Einar J. Aas : Norwegian University of Science & Technology, NO

A Review of Power Strategies for DFT and ATPG
Richard ILLMAN · Brion KELLER · Sandeep BHATIA : Cadence, USA

ScanBurst - Scan Infrastructure and Environment for Highly Effective At-Speed Testing
Stephen PATERAS · Peter SHIELDS : LogicVision, USA

Realizing yield improvements with YieldAssist: High Volume Scan Diagnosis and Analysis
Brady BENWARE : Mentor Graphics, USA

12:30-14:00 Lunch 

14:00-15:30 Vendor Session 3C: Test Equipment and Solutions

Moderators
- Yervant Zorian : Virage Logic, US
- Gunnar Carlsson : Ericsson, SE

The FLEX Architecture - High Efficiency Multisite Test
Martin STADLER : Teradyne, Germany

Scalable System Platform for Cost Effective Mixed Signal Test Solutions
Bruce MacDONALD : LTX, USA

Solutions for Testing Complex SoCs
Martin FISCHER : Verigy, Germany

16:30-18:00 Vendor Session 5C: Intelligent Test Flows

Moderators
- Bernd Koenemann : Visiting Professor, Universität Bremen, DE
- Jerzy Tyszer : Poznan University of Technology, PL

Multiple Benefit by Adaptive Testing
Gil BALOG : OptimalTest, Israel

New RF Test Technologies for lower cost and flexibility
Bill BURROWS : Aeroflex Test Solutions, United Kingdom

Enabling DUT-ATE Interaction
Frank GROSSMANN : SPEA, Germany

20:00-22:00 Dinner 

Location: Feierling
More detailed information can be found here.

May 22nd, 2007

8:30-10:00 Vendor Session 7C: Key Technology: Electrical Contacts

Moderators
- Joan Figueras : UPC, ES
- Carsten Wegener : Infineon, DE

Probing Challenges for Next Generation SoC Devices
Sergio PEREZ : FormFactor, USA

New Low Inductance Socket Technology for High Speed Memory Device Testing
Joachim MOERBT : Advantest, Germany

Multi-site Test - Extraordinary DFT Desired
Peter MUHMENTHALER : Infineon Technologies, Germany

11:00-12:30 Vendor Session 9C: Test Communities

Moderators
- Christian Landrault : LIRMM, FR
- Erik Larsson : Linköping University, SE

Semiconductor Test Consortium Expands its Charter
Klaus LUTZ : Advantest, Germany

STC - New Working Group for Docking and Interfacing
Florian PUTZ : esmo, Germany

The STC's University Working Group Drives Alignment of Industry
Paul RODDY : Semiconductor Test Consortium STC, USA

12:30-14:00 Lunch 

May 23rd, 2007

12:30-14:00 Lunch